Apecor Corp
- View government funding actions
- Orlando, FL 328262930
- Phone: 407-275-1174
- Corporate URL: www.apecor.com
- Estimated Number of Employees: 5
- Estimated Annual Receipts: $500,000
- Business Start Date: 2001
- Contact Person: Antoine Khoury
- Contact Phone: 407-476-4747
- Contact Email: akhoury@apecor.com
- Business Structure:
- Corporate Entity (Not Tax Exempt)
- Business Type:
- For Profit Organization
- Subchapter S Corporation
- Industries Served: Solar Electric Power Generation, Research and Development in the Physical, Engineering, and Life Sciences (except Biotechnology)
- Product Areas: MOTORS, ELECTRICAL, SOLAR ELECTRIC POWER SYSTEMS, R&D-ELECTRONICS & COMM EQ-B RES, R&D- DEFENSE SYSTEM: ELECTRONICS/COMMUNICATION EQUIPMENT (BASIC RESEARCH), R&D- DEFENSE SYSTEM: ELECTRONICS/COMMUNICATION EQUIPMENT (OPERATIONAL SYSTEMS DEVELOPMENT), R&D-ELECTRONICS & COMM EQ-OPSY DEV, R&D- DEFENSE SYSTEM: ELECTRONICS/COMMUNICATION EQUIPMENT (COMMERCIALIZED), R&D-ELECTRONICS & COMM EQ-COMERCLIZ, OTHER DEFENSE (ENGINEERING), R&D- DEFENSE OTHER: OTHER (ENGINEERING DEVELOPMENT)
Sampling of Federal Government Funding Actions/Set Asides
In order by amount of set aside monies.
- $50,000 - Tuesday the 21st of January 2014
National Aeronautics And Space Administration
NASA SHARED SERVICES CENTER
SILICON CARBIDE (SIC) AND OTHER WIDE BAND-GAP SEMICONDUCTORS OFFER GREAT PROMISE OF HIGH POWER RATING, HIGH OPERATING TEMPERATURE, SIMPLE THERMAL MANAGEMENT, AND ULTRA-HIGH POWER DENSITY FOR BOTH SPACE AND COMMERCIAL POWER ELECTRONIC SYSTEMS. HOWEVER, THIS GREAT POTENTIAL IS SERIOUSLY LIMITED BY THE LACK OF RELIABLE HIGH TEMPERATURE DEVICE PACKAGING TECHNOLOGY. THE OBJECTIVE OF THIS PROPOSED RESEARCH IS TO DEVELOP A ULTRA-COMPACT, HYBRID POWER MODULE PACKAGING TECHNOLOGY BASED ON THE USE OF DOUBLE LEADFRAMES AND DIRECT LEADFRAME-TO-CHIP TRANSIENT LIQUID PHASE (TLP) BONDING THAT ALLOWS DEVICE OPERATION UP TO 450 DEGREES CELSIUS. THE UNIQUE ADVANTAGES OF THIS INNOVATIVE SOLUTION INCLUDE VERY HIGH CURRENT CARRYING CAPABILITY, LOW PACKAGE PARASITIC IMPEDANCE, LOW THERMO-MECHANICAL STRESS AT HIGH TEMPERATURES, DOUBLE-SIDE COOLING, AND MODULARITY FOR EASY SYSTEM-LEVEL INTEGRATION. THE NEW POWER MODULE WILL HAVE A VERY SMALL FORM FACTOR WITH 3-5X REDUCTION IN SIZE AND WEIGHT FROM THE PRIOR ART, AND CAPABLE OF OPERATING FROM 450C TO -125C - $200,000 - Tuesday the 21st of January 2014
National Aeronautics And Space Administration
NASA SHARED SERVICES CENTER
SILICON CARBIDE (SIC) AND OTHER WIDE BAND-GAP SEMICONDUCTORS OFFER GREAT PROMISE OF HIGH POWER RATING, HIGH OPERATING TEMPERATURE, SIMPLE THERMAL MANAGEMENT, AND ULTRA-HIGH POWER DENSITY FOR BOTH SPACE AND COMMERCIAL POWER ELECTRONIC SYSTEMS. HOWEVER, THIS GREAT POTENTIAL IS SERIOUSLY LIMITED BY THE LACK OF RELIABLE HIGH TEMPERATURE DEVICE PACKAGING TECHNOLOGY. THE OBJECTIVE OF THIS PROPOSED RESEARCH IS TO DEVELOP A ULTRA-COMPACT, HYBRID POWER MODULE PACKAGING TECHNOLOGY BASED ON THE USE OF DOUBLE LEADFRAMES AND DIRECT LEADFRAME-TO-CHIP TRANSIENT LIQUID PHASE (TLP) BONDING THAT ALLOWS DEVICE OPERATION UP TO 450 DEGREES CELSIUS. THE UNIQUE ADVANTAGES OF THIS INNOVATIVE SOLUTION INCLUDE VERY HIGH CURRENT CARRYING CAPABILITY, LOW PACKAGE PARASITIC IMPEDANCE, LOW THERMO-MECHANICAL STRESS AT HIGH TEMPERATURES, DOUBLE-SIDE COOLING, AND MODULARITY FOR EASY SYSTEM-LEVEL INTEGRATION. THE NEW POWER MODULE WILL HAVE A VERY SMALL FORM FACTOR WITH 3-5X REDUCTION IN SIZE AND WEIGHT FROM THE PRIOR ART, AND CAPABLE OF OPERATING FROM 450C TO -125C
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